大焊插件專用錫膏
大焊插件專用錫膏
大焊插件專用錫膏
大焊插件專用錫膏
大焊插件專用錫膏

大焊插件專用錫膏

價格

訂貨量(公斤)

￥220.00

≥10

聯系人 溫先生

钳钶钴钹钹钼钳钻钺钵钷

發貨地 廣東省東莞市
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東莞大焊電子材料技術有限公司

店齡5年 企業認證

聯系人

溫先生

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钳钶钴钹钹钼钳钻钺钵钷

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廣東省東莞市

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商品參數
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商品介紹
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聯系方式
品牌 大焊
熔點 217度
材質 金屬
形狀 膏狀
用途 焊接
適用范圍 電子、五金
活性 RMA
凈重 500克
產地 東莞
是否加工訂制 是
商品介紹
錫膏使用指南
A Guide to the Operation of Solder Pastes
  一、錫膏的儲存
I. Storing solder pastes
 A.錫膏應保存在5-10℃環境下，保質期為六個月（從生產日算起）。
B.在使用前，預先將錫膏從冰箱中取出室溫下至少4小時，這是為了使錫膏恢復至工作溫度，也是為防止水份在錫膏表面冷凝。
A. The solder pastes should be kept under the temperature of 5-10℃ at the shelf life of 6 months (calculated from the date of manufacture).
B. Before operation, first take the solder pastes out of refrigerators and let them stay at a room temperature for at least 4 hours to enable the solder pastes to recover to the operating temperature and also to prevent moisture from surface condensation on solder pastes.
  
  二、 錫膏攪拌
II. Solder paste mixing
 A.為了使錫膏完全地混合均勻，在回溫后請充分攪拌錫膏。
B．機器攪拌一般為1~3分鐘，人工攪拌一般為3~6分鐘（錫膏儲存的時間越長，則攪拌時間越長）。
A.In order for solder pastes to be completely mixed in a well distributed manner, after the return of temperature, please adequately mix the solder pastes.
B. The mechanical mixing usually last 1 to 3 minutes, while manual mixing usually lasts 3 to 6 minutes (The longer time the solder pastes are kept, the longer time the mixing requires).
  
  三、使用環境
III. Operating Environment
 錫膏最佳的使用環境：溫度為20~25℃，濕度為35~60%。
Optimal operating environment of solder pastes: temperature at 20~25℃, and humidity 35~60%。
  
  四、印刷
IV. Printing
 印刷時錫膏使用注意事項：
A、將錫膏約1/3的量添加于鋼網上，并以少量多次的添加方式補足鋼網上的錫膏量、以維持錫膏的品質。
B、當天未使用完的錫膏，不可與尚未使用的錫膏共同放置，應另外存放在別的容器中。錫膏開封后在室溫下建議于24小時內用完。
C、當天未用完的錫膏，隔天使用時建議將未用完的錫膏與新錫膏以1：2的比例攪拌混合使用，并以少量多次的方式添加使用。
D、錫膏印刷在基板上后，建議于4～6小時內放置元件進入回焊爐。
E、換線超過一小時以上，請于換線前將錫膏從鋼網上刮起收入錫膏罐內封蓋。
F、盡可能不要接觸到皮膚，如接觸時請用異丙醇清洗，并且避免吸入揮發之氣體。
Cautions in the operation of solder pastes during printing:
A、 Add 1/3 solder pastes on a steel screen by supplementing enough solder pastes in a manner of a small amount in several times to maintain the quality of solder pastes.
B、 For the solder pastes that have not run out, do not place them together with those unused solder pastes. They should be put in other containers. After being unsealed, the solder pastes should be completely used under a room temperature within 24 hours.
C、 For the solder pastes that have not run out the same day, it is recommended that the unused solder pastes on the other day will be mixed with new solder pastes in the ratio of 1:2 for mixing and using, and they will be used in a manner of adding in a small amount in several times.
D、 After solder pastes are printed on substrates, it is recommended that components should be placed into the return solder pots within 4 to 6 hours.
E、 When wire exchange exceeds one hour or more, please scrape the solder pastes up from the steel screen and put it into the solder paste container for sealing.
F、 Try not to make it contact skin. In the case of any such contact, please use isopropanol for rinsing, and try to avoid inhalation of the volatile gases.s
  
  五、 回流
V. Backflow


 例： SnAgCu 無鉛錫膏曲線
Example: Curve of SnAgCu Pb-free Solder Pastes
活化時間：Activating time
加熱區：Heating zone
預熱區：Preheating zone
時間：Time
回流區：Backflow zone
冷卻區：Cooling zone
※其他各產品溫度曲線請索閱各錫膏產品規格書。
※ For the curve of temperature of other products, please refer to the specifications of solder paste products.
聯系方式
公司名稱 東莞大焊電子材料技術有限公司
聯系賣家 溫先生
手機 钳钶钴钹钹钼钳钻钺钵钷
地址 廣東省東莞市